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XELIOS.com >> Products >> Hardware >> Biometric sensors >> MSO 1300X >> Technical Characteristics

MSO 1300X

Technical Characteristics

SENSOR

 

Type

• SAGEM DS ultra plat optical sensor

Active surface

• 14 x 22 (mm)

Resolution

• 500dpi / 256 grey level

PHYSICAL

 

Plug and Play

• Yes

Dimensions

• 53, 7 x 33, 7 x 13, 5 (mm)

Weight

• 20g

Processor

• Central processor ARM9™

Alimentation

• Connection : Port USB

• Alimentation : 3 to 5,5 V

• Power consumption:

- Standby : 500µA max. to 5V
- Active sensor : 300mA max. to 5V
- Inactive sensor : 100mA max. to 5V

SECURITY

 

Algorithm

• MorphoImaging™ & MorphoSoft™ Embedded

• The biometric and cryptographic done in the peripheral

PKI

• Each module has its’ own X.509 certificate

Storage capacity

• 1000 fingerprint templates

Requêtes

• 1:1 (verification) and 1: N (identification)

Speed

• Verification : < 0,8 sec.
• Identification : < 1 sec.